Polyimide Coverlay is made of polyimide film coated by modified stage-B acrylic on single side with protection release film or paper.
Polyimide Coverlay is widely used in protection of FPCB and other relevant fields.
Characters:
* Excellent dielectric performance,high bondability and good dimension stability;
* Low fluidility and good processability;
* Supplied with different sizes and colours(yellow,black,white);
NOTE: Please just contact us for customized polyimide bondply and stiffener of this material
Spec.:
Models :AD/PI/AD
(AD=adhesive PI=polyimide film)
|
Unit
|
PIC-5A
12.5/12.5/0
|
PIC-10A
25/25/0
|
PIC-20AS
25/50/0
|
PIC-30AS
25/75/0
|
Typical total thickness
|
mm±10%
|
0.025
|
0.05
|
0.075
|
0.10
|
Film thickness
|
mm
|
0.0125(0.5mil)
|
0.025(1mil)
|
0.05(2mil)
|
0.075(3mil)
|
Adhesive thickness
|
mm
|
0.0125
|
0.025
|
0.025
|
0.025
|
Nominal weight
|
g/m2±10%
|
35
|
70
|
105
|
140
|
Supply sizes & packing: standard roll: 50 square meters per roll,width:500mm,length:100m; carton after winded up
into log roll and sealed by plastic film bag,core size:3"(76mm)
Note: Both customization and epoxy counterpart also available
Typical properties(the follows are just examples not read as guaranteed values)
Items
|
unit
|
Test method
|
Typical datas
|
1. peel Strength
-As normal conditions
After Soldering
|
N/mm--width
|
IPC-TM-650-2.4.9
|
1.05
1.05
|
2.Dimension Stability
|
%
|
IPC-TM-650-2.2.4A
|
0.12
|
3.Adhesive flow
|
um
|
IPC-TM-650-2.3.17.1
|
<130
|
4. Volatile Content
|
%
|
IPC-TM-650-2.3.37
|
≤3.0
|
5. Soldering float
|
288℃/10sec.
|
IPC-TM-650-2.4.13
|
pass
|
6. Moisture Absorption
|
%
|
IPC-TM-650-2.6.2
|
≤4.0
|
7. Dielectric strength
|
kv/mm
|
ASTM-D-149
|
≥50
|
8. Chemical resistance
|
%
|
IPC-TM-650-2.3.2
|
≥80
|
9. Dielectric constant
|
MHZ
|
IPC-TM-650-2.5.5.3
|
≤4.0
|
10.Dissipation factor
|
----
|
IPC-TM-650-2.5.5.3
|
≤0.04
|
11. Volume resistivity
|
MΩ-cm
|
IPC-TM-650-2.5.17
|
108
|
12. Surface resistivity
|
MΩ
|
IPC-TM-650-2.5.17
|
106
|
Sotrage: keep dry and cool, Shelf life:12 months
Application: Polyimide Coverlay is mainly used in protection of flexible printed circiut board and other relevant fields.
|