PIR-002TP polyimide resin
PIR-002TP is unfilled thermal plastic polyimide resin powder, widely used as matrix resin for shapes,components and parts with excellent physical properties.
Note: Thermosetting counterpart also available
Characters:
* Good compatibility with fillers:graphite,glass fiber,PTFE,MoS2,etc.
* Low wear and friction
* Excellent heat resistance.
* Excellent dielectric performance.
* Excellent chemical resistance.
*Higher mechanical strength, better tear resistance.
*Machinable with standard tools
Typical Properties( The follows are just examples not read as guaranteed values)
|
Items
|
Test methods |
Units |
Typical Value |
|
1.Visual
|
Light yellow for unfilled one |
||
|
2.Tensile strength 23℃/250℃
|
ASTM/D1708 |
MPa |
85/50
|
|
3. Elongation
|
ASTM/D1708 |
% |
5.5 |
|
4.Flextural strength 23℃/250℃
|
ASTM/D790 |
Mpa |
100/55 |
|
5.Flextural Modulus 23℃/250℃
|
ASTM/D790 |
Mpa |
34150/1875 |
|
6.Izod notched impact 23℃ |
ASTM/D256 |
kg-cm/cm² |
70 |
|
7.Izod unnotched impact 23℃ |
ASTM/D256 |
kg-cm/cm² |
12 |
|
8.Compressive strength 23℃ 10% strain |
ASTM/D695 |
MPa |
110 |
|
9. Vol. Resistivity
|
ASTM/D257 |
Ω.m |
> 1 x 1014 |
|
10. Surface Resistivity, |
ASTM/D257 |
Ω |
> 1 x 1015 |
|
11.Dielectric constant
|
ASTM/D150 |
|
2.5--3.0 |
|
12.Coefficient of linear expansion nnsexpansion |
ASTM/D696 |
10-5cm/cm/℃
|
4.5 |
|
13.Friction coefficient
|
GB3960 |
|
0.3 |
|
14. Glass transition temp. Tg |
DSC204/1/F |
℃ |
260 |
|
15. Specific Gravity |
ASTM/D1505 |
|
1.4 |
Packing: carton after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.