Ultrathin polyimide film
Ultra thin Polyimide Film has ultra thin thickness:3um,5um,7um,etc. ,widely used in manufacturing flexible circuit board, and other fields.
Characters:
*Excellent heat stability, good mechanical strength
*Excellent dielectric performance.
*Radiation and Chemical resistance.
*Supplied with different thickness:3um,5um,7um*standard width:520mm/1040mm
Spec.:
|
Type |
UTPIF-3 |
UTPIF-5 |
UTPIF-7 |
|
Thickness mm |
0.003±0.003 |
0.005±0.005 |
0.007±0.005 |
|
Basic weight g/m2±10% |
4.2 |
7 |
9.8 |
Лcustomization can also be available
Typical Properties( The follows are just examples not read as guaranteed values):
|
items
|
Test methods |
Units |
Typical Value
|
|
1. Visual |
The surface should be even and free from wrinkle, blister, adhesive particle impurity. |
||
|
2.Tensile strength |
ASTM/D882 |
MPa |
Min.300 |
|
3. Elongation
|
ASTM/D882 |
% |
Min.15 |
|
4.Dielectric strength |
ASTM/D149 |
kV/mm |
Min.300 |
|
5. Vol. Resistivity,
|
ASTM/D257 |
Ω.m |
> 1 x 1013 |
|
6. Surface Resistivity, |
ASTM/D257 |
Ω |
> 1 x 1015 |
|
7.Dielectric constant |
ASTM/D150 |
|
3.5±0.4 |
|
8.Dielectric dissipation factor |
ASTM/D150 |
|
≤4.0×10-3 |
|
9.Dimensional Stability |
IPC TM 650,2.2.4A |
% |
≤0.1 |
|
10. Temperature index |
UL746B（Mech.）
|
℃ |
230 |
|
UL746B（Elec.） |
|
230 |
|
|
11. Moisture absorption |
ASTM/D570
|
% |
≤4.0 |
|
12. Flammability |
UL-94 |
|
V-0
|
|
13. Specific Gravity |
ASTM/D1505 |
|
1.42 |
Storage:
The product is packed in reinforced carton and sealed in plastic film bag. Please keep dry and in room temperature. Shelf life is 24 months.
Application:
Ultra thin polyimide Film is widely used in flexible printed circuit board, etc.
Note: 1.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
2.Please contact us if customization requirements.