PIR-004 BTDA-based polyimide resin
(BTDA is abbr.:3,3’4,4’-Benzophenonetetracarboxylic dianhydride)
Base Structure:
Characters:
* Good compatibility with fillers:graphite,glass fiber,PTFE,MoS2,etc.
* Low wear and friction * Excellent heat resistance.
* Excellent dielectric performance. * Excellent chemical resistance.
*Higher mechanical strength, better tear resistance.*Machinable with standard tools
Typical Properties( The follows are just examples not read as guaranteed values)
|
Items |
Test methods |
Units |
Typical Value |
|
1.Visual/solubility |
Light yellow for unfilled one,soluble in DMF,DMAC,etc. |
||
|
2.Tensile strength 23℃ |
ASTM/D1708 |
MPa |
110 |
|
3. Elongation |
ASTM/D1708 |
% |
6.5 |
|
4.Flextural strength 23℃ |
ASTM/D790 |
Mpa |
155 |
|
5.Flextural Modulus 23℃ |
ASTM/D790 |
Mpa |
3600 |
|
6.Unnotched impact strength 23℃ |
ISO179 |
KJ/m² |
70 |
|
7.Compressive strength 23℃ 10% strain |
ASTM/D695 |
MPa |
135 |
|
8. Vol. Resistivity |
ASTM/D257 |
Ω.m |
> 1 x 1014 |
|
9. Surface Resistivity |
ASTM/D257 |
Ω |
> 1 x 1015 |
|
10.Dielectric constant |
ASTM/D150 |
|
2.5--3.0 |
|
11.Coefficient of linear expansion |
ASTM/D696 |
10-5cm/cm/℃ |
4.5 |
|
12.Friction coefficient |
GB3960 |
|
0.25-0.3 |
|
13.Glass transition temp. Tg |
DSC204/1/F |
℃ |
320 |
|
14. Specific Gravity |
ASTM/D1505 |
|
1.34 |
Packing: carton or drum after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.