1145
PIR-003 polyimide resin powder is unfilled soluble polyimide with bismaleimide structure and particle size:300mesh,widely used as matrix resin for prepreg of fibers, membrane, mixture with epoxy for heat resistance, etc.
Note:Different polyimide types also available for different applications
Base structure:
Properties:
| Visual/Solubility | Fine yellow powder/soluble in DMF,NMP,etc. |
| Purity% | Over 98.5 |
| Gravity | 1.32g/cm3 |
| Gelling time(170℃) | 200--500s |
| Curing temperature(℃)/Pressure(MPa) | 220-230/30-60 |
| Softening temperature（℃） | 90-120 |
| Martin temperature（℃） | 260 |
| TGA260（℃）24hr/300（℃）24hr | Less 1.5% (mainly moisture loss) |
| Tg（℃） | 330 |
| Tensile strength(MPa) | 113.4 |
| Elongation% | Over 5% |
| Surface resistivityΩ | 1 x 1015 |
| Dieletric constant | 3.5 |
Packing: carton after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.
Contact information:
Company: WJF Chemicals Co. Ltd. QuZhou (website: www.wjfchemicals.com)
Address: 601 ZhongXing Plaza No. 123 HeHua ZhongLu QuZhou ZheJiang Province China
Email: info@wjfchemicals.com ; jeffeywang@hotmail.com
Tel./Fax: +865703865831 Mob.:+8613059765326(we chat)
